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The Microelectronics Research Laboratory works closely with researchers in academic, government and industry to help solve problems in multidisciplinary science and engineering and high-tech industry, to carry out advanced research in micro- and nano-optoelectronics, solid state devices and electronic materials. The capabilities of the laboratory include a dry processing area for plasma processing, thin film metallization and dielectric, thermal processing, ultraviolet lithography, nano-imprint and most recently atomic layer deposition.
The Rutgers Food Innovation Center (FIC) is a unique business incubation and economic development accelerator program, which provides business and technology expertise to startup and established food companies in the mid-Atlantic region, and utilizes its outreach capacity to reach food and agribusinesses throughout the world. In completing our mission, our FIC t
This course will present an overview of thin film materials characterization with an appropriate selection of analytical methods for imaging and materials characterization in research. This course is open to advanced undergraduates, graduates students and science professionals. It will be especially useful to those who use x-ray spectroscopy, ion beam spectroscopy, electron beam SEMs, AFMs and optical spectroscopies.
The Nutritional Metabolomics Core Facility was established to provide researchers with data on the identities and amounts of small molecules in biological samples.
The facility specializes in the analysis of lipids, including phospholipids, cholesterol and cholesteryl esters, acyl coAs, endocannabinoids, and mono-, di-, and triacylglycerols. Often, data for multiple lipid classes can be obtained from a single sample injection. We plan to increase our offerings to include other metabolite classes as we expand into a full-fledged metabolomics laboratory.
As an integral part of the Rutgers Packaging Engineering Program for more than 20 years, our testing laboratory is approximately 3,000 square feet and is dedicated package testing. It includes a variety of general and specified equipment e.g.. to measure package dimensions, functionality and product compatibility. Much equipment is devoted to measuring conformance to industry and regulatory mandated performance, including: UPS, National Institutes of Standards and Technology (NIST), and the American Society of Testing and Materials (ASTM) standards.